Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
2026 · 1st Quarter (Jan 1 - Mar 31)
SAMSUNG ELECTRONICS AMERICA
Filed by CAPITOL CONSULTING GROUP LLC (DC).
Open official filingSource-reported fields
Filing overview
- Type
- 1st Quarter - Report
- Posted
- Apr 20, 2026
- Income
- $70,000.00
- Expenses
- Not reported
- Registrant
- CAPITOL CONSULTING GROUP LLC (DC)
- Filing UUID
- c38eb4e0-0fc8-48d8-9671-58bfecdf555d
- Termination date
- Not reported
Literal source text
Lobbying issues and bill citations
Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
Outreach and monitoring relating to technology issues, including 5G, spectrum and wireless broadband affecting the telecommunications industry. Outreach and monitoring related to supply chain, bilateral and multilateral trade policy and proceedings. Issues related to cybersecurity, the Internet of Things, and artificial intelligence. Issues related to digital divide, STEM education, and issues related to workforce development. Outreach and monitoring related to appropriations including for energy efficiency programs, telecommunications and semiconductor incentives Implementation of Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, PL 117-167
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